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Micro/Nano fabrication services

Focused ion beam
We offer the possibility to make different shape structures in the nano and microscale on different types of substrates, semiconductors and insulators. The smallest resolution achievable is around 20 nm by electron-beam lithography technique, while using the focused ion beam milling we are able to pattern features with sizes down to 10 nm. Moreover, our FIB/SEM dual beam system gives the possibility to deposit nanostructures of a wide variety of materials by focused ion/electron beam induced deposition.

 

E-beam lithography (Raith -150-TWO / E-line)

  • Design fabrication
  • Sample preparation for e-beam
  • Nanostructure fabrication
    • Minimum feature size ≤ 20 nm.
    • Maximum patterned area 4 inch
  • Resist developing
  • Material deposition / milling / etching
  • Lift-off process

Focused ion beam (FIB) patterning – Focused electron/ion beam induced deposition (FE(I)BID) (Dual beam FIB/SEM FEI Helios Nanolab / Helios 450S)

  • Surface patterning by FIB with a minimum feature size of 10 nm (processing areas below mm2)
  • Focused electron/ion beam induced deposition (FE(I)BID) of W, Au, Co, Pt and SiOx
  • Complex structures fabrication (including 3D structure)
  • Characterization FIB/SEM:
    • Automatic 3D imaging
    • Imaging of large areas

Optical lithography (EVG Mask Aligner)

  • Sample preparation
  • Nanostructure fabrication
    • Minimum feature size 5 μm
    • Maximum patterned area 4 inch
  • Resist developing
  • Material deposition / milling / etching
  • Lift-off process
  • Possibility of mask fabrication

 

 

 

 

 

 

 

 

 

 

 

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