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Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)

System for etching/milling material by a chemically reactive gases

No
  • Possibility to use different gasses, such as, oxygen (O2), tetrafluoromethane (CF4), trifluoromethane (CHF3) and sulfur hexafluoride (SF6).
  • 5 - 500 mTorr operating pressures.
  • Sample holder: 8” compatible
Research Groups: 
Related Techniques: 
Related Sectors: 
Automotive industry
Electron microscopy laboratories
Material science industry
Medical applications
Cleanroom: 
CR3 - Etching Bay
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