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Atomic Layer Deposition – Thin Film Evaporation

Atomic Layer Deposition – Thin Film Evaporation

Atomic layer deposition (ALD) is a thin film deposition technique that is based on the sequential use of a gas phase chemical process. Precursors (chemicals) react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited.

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