Atomic layer deposition (ALD) is a technique used to deposit very thin layers of material in coatings to improve a given physical property or the mechanical properties of a material. This technology is very versatile and useful, but it has been found that the design of chambers for ALD processes, generally oriented to 2D substrates, e.g. silicon wafers as used in microelectronics, does not allow the deposition on complex shaped substrates that may have large sizes or non-geometric shapes (e.g. implants, fibers, and metallurgical parts).
