Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)
System for etching/milling material by a chemically reactive gases
What we can offer:
Micro structure fabrication
Micro and nano structures and devices on different substrates (glass, silicon, CaF2)
Customized structured calibration and reference samples (microscopy, metrology).
Hydrophobic / hydrophilic surfaces
Cleaning of surfaces, i.e. remove organic layers, oxide layers
Activation of plastic and ceramics as pre-treatment
Surface topography modification by selective etching or roughness increase
Interesting for (with the system):
Material science, microelectronics and semiconductors, automotive, laboratory test facilities, microscopy laboratories, machine tool manufacturers, iron and steel industry...
- Possibility to use different gasses, such as, oxygen (O2), tetrafluoromethane (CF4), trifluoromethane (CHF3) and sulfur hexafluoride (SF6).
- 5 - 500 mTorr operating pressures.
- Sample holder: 8” compatible
External services type
CR3 - Etching Bay
External services title
Reactive Ion Etcher (RIE)