Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)

Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)

System for etching/milling material by a chemically reactive gases

Research group

What we can offer:

Micro structure fabrication


  • Micro and nano structures and devices on different substrates (glass, silicon, CaF2)

  • Customized structured calibration and reference samples (microscopy, metrology).

  • Hydrophobic / hydrophilic surfaces

  • Cleaning of surfaces, i.e. remove organic layers, oxide layers

  • Activation of plastic and ceramics as pre-treatment

  • Surface topography modification by selective etching or roughness increase

Interesting for (with the system):

Material science, microelectronics and semiconductors, automotive, laboratory test facilities, microscopy laboratories, machine tool manufacturers, iron and steel industry...

Technical characteristics
  • Possibility to use different gasses, such as, oxygen (O2), tetrafluoromethane (CF4), trifluoromethane (CHF3) and sulfur hexafluoride (SF6).
  • 5 - 500 mTorr operating pressures.
  • Sample holder: 8” compatible
External services type
CR3 - Etching Bay
Related Techniques
External services title
Reactive Ion Etcher (RIE)