Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)

Reactive ion etcher (RIE Oxford Plasmalab 80 Plus)

System for etching/milling material by a chemically reactive gases

Research group
Technical characteristics
  • Possibility to use different gasses, such as, oxygen (O2), tetrafluoromethane (CF4), trifluoromethane (CHF3) and sulfur hexafluoride (SF6).
  • 5 - 500 mTorr operating pressures.
  • Sample holder: 8” compatible
CR3 - Etching Bay
Related Techniques


The nanoGUNE cleanroom, dedicated to fabricate and characterize the properties of materials on the nanoscale, ia a 300m2 laboratory where the air purity is under strict supervision.


State-of-the-art equipment, including electron and scanning-tunneling microscopes, as well as other nanofabrication and characterization tools, are managed by specialists and used by researchers from a wide variety of fields.